3.2 mm x 5.0 mm ceramic package smd oscillator, lvpe cl ism88 series ilsi america phone: 775-851-8880 ? fax: 775-851-8882? e-mail: e-mail@ilsiamerica.com ? www.ilsiamerica.com 01/11_a specifications subject to change without not ice page 1 recommended pad layout dimension units: mm pin connection 1 enable 2 n.c. 3 v ss 4 output 5 comp. output 6 v dd product features: applications: surface mount package test equipment low jitter server & storage reflow compatible sonet /sdh compatible with leadfree processing note: a 0.01 f bypass capacitor is recommended between vcc (pin 6) and gnd (pin 3) to minimize power supply noise. * not avai lable for all temperature ranges and frequencies. frequency 25 mhz to 350.000 mhz output level v oh = v cc - 1.02 vdc min. v ol = v cc - 1.62 vdc max. duty cycle 50% 5% rise / fall time 1.0 ns max. output load 50 ? to vcc - 2.0 vdc frequency stability 25ppm enable phase delay 2 ms max. disable phase delay 200 ns max. supply voltage see input voltage table, tolerance 5 % current 55 ma typical, 90 ma max. operating 0 ? c to +70 ? c storage -40 ? c to +85 ? c integrated jitter rms 0.3 typ. (12 khz to 20 mhz band) part number guide sample part number: ism88 ? 3159ah - 156.250 package input voltage operating temperature symmetry (duty cycle) output stability (in ppm) enable / disable frequency ism88 - 3 = 3.3 v 1 = 0 ? c to +70 ? c 5 = 45 / 55 max. 9 = lvpecl a = ? 25* h = enable - 156.250 mhz 6 = 2.5 v 2 = -40 ? c to +85 ? c z = ? 30 b = ? 50 c = ? 100
3.2 mm x 5.0 mm ceramic package smd oscillator, lvpe cl ism88 series ilsi america phone: 775-851-8880 ? fax: 775-851-8882? e-mail: e-mail@ilsiamerica.com ? www.ilsiamerica.com 01/11_a specifications subject to change without not ice page 2 pb free solder reflow profile: typical application: *units are backward compatible with 240c reflow processes package information: msl = n.a. (package does not contain plastic, storage life is unlimited under normal room conditions). termination = e4 (au over ni over w base metalization). tape and reel information: environmental specifications thermal shock mil-std-883, method 1011, condition a moisture resistance mil-std-883, method 1004 mechanical shock mil-std-883, method 2002, condition b mechanical vibration mil-std-883, method 2007, condition a resistance to soldering heat j-std-020c, tabl e 5-2 pb-free devices (except 2 cycles max) hazardous substance pb-free / rohs / green compliant solderability jesd22-b102-d method 2 (preconditioning e) terminal strength mil-std-883, method 2004, test condition d gross leak mil-std-883, method 1014, condition c fine leak mil-std-883, method 1014, condition a2, r1=2x10-8 atm cc/s solvent resistance mil-std-202, method 215 marking line 1: ilsi and date code (yww) line 2: frequency quantity per reel 1000 a 16 +/-.3 b 8 +/-.2 c 7.5 +/-.2 d 17.5 +/-1 e 50 / 60 / 80 f 180 / 250
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